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Unimicrn Uses the General-Purpose AI-Powered CAE Optimization Platform of SmartDO to Increase The Electromagnetic Performance of Circuit

09-JUL-2024

Unimicrn Uses the General-Purpose AI-Powered CAE Optimization Platform of SmartDO to Increase The Electromagnetic Performance of Circuits


Electromagnetic interference (EMI) is a major concern in circuit design, as it can cause signal degradation, data loss, and device malfunction, impacting overall performance and reliability.
Unimicron (based in Taiwan), one of the largest printed circuit board (PCB) manufacturer on earth, uses their patented coaxial via to compensate and optimize the electromagnetic performance of the eletric circuits.

Design optimization of coaxial vias is a very challenging problem, due to its complicated interaction between parameter, manufacturing limit and the physical phenomenon.

Therefore Unimicron uses the General-Purpose AI-Powered CAE Optimization Platform in SmartDO to toggle this problem, which is difficult for many traditional tools and methods.

The primary reason for using the coaxial structure is because it can effectively reduces electromagnetic interference (EMI) and signal loss. This is achieved by more uniform current distribution and better shielding provide by coaxial vias, which decreases parasitic inductance and capacitance.

Figure 1 shows the layout and geometric shape of a typical coaxial via.

Figure 1. Layout and Geometric Shape of a Typical Coaxial Via.


The formulation of the design problem in SmartDO is defined as followed. One of the challenge is the number of pad. From experience it has big influence, but the value should be integer. This is difficult for most optimizer to handle. However, since it is discrete but differentiable, SmartDO can handle this kind of DV by transferring it to alternative formulation. Figure 2 and Figure 3 shows the 13 design variables of the via.

  • Find : DV1~DV13
  • To Match : TDR impedance (52± 10%)ohm
  • Subjected to :
    • Ground via distance >= 75 um
    • RL_@4GHz < -24
    • IL_@4GHz < 0.5
  • RL : Return Lost
  • IL : Insertion Lost

Figure 2. 13 Design Variables Of the Via (1/2)


Figure 3. 13 Design Variables Of the Via (2/2)


Figure 4 shows the final numerical result optimized by SmartDO. As can be seen in the table, TDR impedance was adjusted to 50 ohm (on target) from the intiail value of 83.2.
Figure 5 shows the final layout and configuration of the coaxial via optimized by SmartDO. The shape and configuration has been significantly modified.
SmartDO takes 140 times calculation for the external EMI software to achiave this final optimal result.

Figure 4. Final Numerical Result Optimized by SmartDO


Figure 5. Final Layout and Configuration of the Coaxial Via Optimized by SmartDO


SmartDO is a general purpose AI-Powered CAE optimization system, which means it can be use to solve different engineering problem in different fields. Taking this newsletter as an example, SmartDO can optimize electromagnetic performance by utilizing AI-driven optimization algorithms to fine-tune design parameters, reduce EMI, and enhance signal integrity, ensuring optimal circuit functionality and efficiency without much humand interference.

For more information about SmartDO, please contact us.



More Information

FEA-Opt Technology Co. Ltd. is an international RD/Consultancy/CAE and Software firm. We provide superior RD/consultancy services to our customers, and customized solutions for each customer's special need.


SmartDO, our flagship product, is A General-Purpose AI-Powered CAE Optimization Platform. It provide unique technology for push-button automatic design optimization and Digital Production Line Integration and Automation. For details about SmartDO, please visit our web site at http://www.SmartDO.co/